BASF today signed a Letter of Intent (LOI) with Taiwan’s Ministry of Economic Affairs (MOEA), underscoring its long-term commitment to supporting the growth of Taiwan’s semiconductor ecosystem. Through this investment, BASF’s Electronic Materials business is expanding its Kuanyin site in Taoyuan with additional production capacity for advanced semiconductor materials, enhanced quality analysis capabilities, and an expanded Innovation Center.

BASF SE and Highsun Holding Group (HSCC) have signed a non-binding Memorandum of Understanding to explore the combination of their respective European activities across the polyamide 6 (PA6) value chain in a 50:50 joint venture.